FIC Global Inc. (FICG) has signed strategic partnerships in Malaysia and Singapore to strengthen its manufacturing, innovation and supply chain capabilities across Southeast Asia, positioning the company to better support growing demand from AI, high-performance computing (HPC), data centers and semiconductor industries.
The Taiwan-listed technology group formalized two memoranda of understanding during the ASEAN Conference 2026 in Singapore. Its manufacturing subsidiary, PRO3C, signed an agreement with AME Elite Consortium Berhad (AME) to support manufacturing expansion in Johor, while FICG partnered with Jurong Town Corporation (JTC) to establish a regional innovation and supply chain hub in Singapore.
The collaborations underpin FICG’s Johor–Singapore Special Economic Zone (JS-SEZ) Twinning Strategy, which integrates manufacturing operations in Johor with innovation, strategic sourcing, supply chain management and customer engagement functions in Singapore.
The company said the cross-border model is designed to leverage Malaysia’s manufacturing ecosystem alongside Singapore’s strengths in innovation, talent, financial infrastructure and global connectivity. FICG expects the integrated approach to improve operational resilience, supply chain flexibility and responsiveness to customers across ASEAN and international markets.
PRO3C will continue expanding production capacity at its Johor manufacturing campus to meet rising demand from AI, semiconductor, data center and other advanced technology sectors. AME will support the expansion through its expertise in industrial park development, customized manufacturing facilities and engineering solutions.
Meanwhile, FICG plans to establish a Regional Innovation and Supply Chain Centre in Singapore, which will oversee innovation, strategic sourcing and regional supply chain operations while strengthening customer engagement across the Asia-Pacific region. The initiative is also supported by UOB, which will provide cross-border banking services and regional business connectivity.
Beyond semiconductor packaging and advanced printed circuit board assembly (PCBA), FICG provides electronic design and manufacturing services for industries including communications, automotive, industrial, avionics, marine, medical and consumer electronics.
According to the company, PRO3C’s Johor campus entered volume production at the end of 2025 and continues ramping up operations. A grand opening for the facility is scheduled for October 2026.
“Global competitiveness is no longer determined by the scale of a single factory. Today, success increasingly depends on how effectively a company connects its manufacturing capabilities, supply chains, innovation resources and customers across borders,” said Leo Chien, chairman of FIC Global.
Chien added that the partnerships with AME and JTC, together with UOB’s regional support, will help the company build a more resilient cross-border platform by combining Malaysia’s manufacturing strengths with Singapore’s innovation and supply chain capabilities.
Source: EETAsia
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<p>Time: November 2025<br /> By: WTO and International Trade Group, Legal Department – VCCI</p>
